Geeetech

Hello everybody

I have great problems in printing some solar shield plates for my weather station with my I3 Pro B. I tried to make them using FormFutura ApolloX ASA filament, as it is a weather-resistant plastic.
The main problem is adehesion of the first layer to the heatbed: i tried a lot of settings (extruder between 235 to 260 C°, heatbed between 70 to 105 C°)
printing speed (from 20 to 70 mm/s) print adehesion help (paper tape, Printafix spray) and slicer (Cura, Repetier Host, Matter Control) but there's no way to keep first layer stuck on printbed.
The second one is warping: one of numerous trials the filament has stuck to paper tape, but proceeding with printing the external BRIM and the support material started to warp and detach from the printbed so i must stop the process
I don't have a nozzle blower fan and i've kept windows and doors closed in my printing-room; my noozle is 0.35 mm
I've also tried to increase extruding width to 130% and extrusion multiplier to 1.2 as suggested by MatterControl
I'm frustrated......
Can anyone help me suggesting some tips or tricks?

I think you should set the temp as the filament temp. And maybe you can add a fan?

Hi William

I've tried multiple temperatures settings in the range suggested by the manifacturer but the filament seems too strong to stick on the printbed
Do you really think that a fan will be helpful?
Have you printed some objects in ASA?
Personally at present i have employed only PLA (without problems) and PETG (a little more complicated than PLA)

Maybe you can contact the filament seller and let him tell you what you should do.

I've written to FormFutura customer service and they told me that optimal temperatures are 245/80°, suggesting to use a Printafix-like spray (done without results)

Now I want to try using vynil glue spread on printbed

Yesterday i've printed the same object in PLA and it is almost perfect....

Happy for you!